| 摘要 |
PROBLEM TO BE SOLVED: To make an optical part mounting substrate able to suitably cope with a driving electric signal even it is of a high frequency, and moreover to make able to dispose an optical semiconductor element with high precision by providing an insulating layer having a small dielectric loss tangent in the low position of a substrate and disposing a driving conductive pattern of the optical semiconductor element thereon. SOLUTION: A light emitting element such as a semiconductor laser and an optical semiconductor element such as a light receiving element for is monitor are mounted on the high position of the substrate 1 in which a difference in level is formed, an insulating film 2 having a dielectric loss tangent smaller than that of the substrate 1 is provided in the low position of the substrate 1 up to the same height as the high position, and driving conductive patterns 7, 9 to be connected to the optical semiconductor element are disposed thereon. The driving conductive patterns 7, 9 are disposed on the both surfaces of the insulating film 2 formed in the area of the difference in level formed on the substrate 1 and an insulating film 6 formed in the whole substrate excepting the area of the difference in level on the upper surface of the substrate 1, and markers 4 for mounting are formed in the insulating film 5. The patterns for forming the markers 4 and a V shaped groove 3 are simultaneously formed after forming the insulating film 2 formed on the area worked so as to become deeper than one main surface of the substrate 1 by a prescribed depth. |
