SEMICONDUCTOR MANUFACTURING DEVICE, ITS CLEANING METHOD AND LIGHT SOURCE UNIT

摘要

PROBLEM TO BE SOLVED: To shorten the downtime attendant on the removal of a sublimable compound, to simplify removal work and improve safety in a semiconductor manufacturing devise for applying an organic film of an anti-reflection film to the surface of a semiconductor wafer. SOLUTION: The top plate 34 of a hot plate 30 heating a semiconductor wafer 38 is formed of a light transmission material such as quartz. A light source unit 36 generating an ultraviolet ray which effectively dissolves organic compound is arranged above the top plate 34. In a hot plate unit 28, the semiconductor wafer 38 to which an organic material has been applied is baked. A sublimable compound contained in the organic material sticks to the lower face of the top plate 34 consequent upon a baking treatment. Whenever the hot plate unit 28 processes the prescribed number of semiconductor wafers 38, the light source unit 36 is allowed to emit light and compound adhered to the top plate 34 is irradiated with the ultraviolet ray.