WIRING SUBSTRATE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a wiring substrate incorporated with a capacitor element which can be manufactured easily moreover at a low cost, and its manufacturing method. SOLUTION: After a capacitor element 13 is arranged in a mold for formation of a substrate, an insulation substrate 3 is formed by injecting a resin into the inside of the mold. Therefore, the capacitor element 13, which is sufficiently large in size (capacitance) to prevent the switching noises of an IC chip or to stabilize the operational power voltage, can be built freely in a wiring substrate 1 in terms of dimension and more easily than heretofore. Then, the possibility of failure to incorporate the capacitor element 13 can be reduced, and results in a low-cost manufacture.