发明名称 ELECTROMAGNETIC BUFFER COVER
摘要 PROBLEM TO BE SOLVED: To provide a device provided with a conduit adopted to the chassis of such an electronic device that reduces the EMI radiation of an electronic module. SOLUTION: An electromagnetic buffer cover has a module support member 10 which houses an electronic module 25, and a conduit 20 containing an electric conductor near the support member 10, and is used together with the chassis of an electronic device. The cover is composed of a conductive body which has a base panel and first and second side panels extended from the base panel and faced oppositely to each other and is adaptive to the conduit, and a boss which is in contact with the conductive case of the electronic module 25. The boss establishes a common potential between the conduit 20 and module 25 by forming a conductive path between the conduit 20 and module 25 and reduces the electromagnetic radiation from the module 25.
申请公布号 JP2001077573(A) 申请公布日期 2001.03.23
申请号 JP20000239397 申请日期 2000.08.08
申请人 LUCENT TECHNOL INC 发明人 MANDELCORN YEHOSHUA;BUSKMILLER MICHAEL R;BYRNE VINCENT MARK;FONTANA EDWARD CLARK
分类号 H05K9/00;(IPC1-7):H05K9/00 主分类号 H05K9/00
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