发明名称 CSP SUBSTRATE SPLITTER
摘要 PROBLEM TO BE SOLVED: To remove a contaminant adhered to the rears of pellets before the pellets are housed in a transfer tray in the case where a CSP substrate is cut to split the CSP substrate into the individual pellets and the individual pellets are housed in the transfer tray. SOLUTION: A CSP substrate splitter of a structure wherein a CSP substrate is cut to split the CSP substrate into individual pellets and the individual pellets are transferred on a transfer tray, at leat comprises a table 75 for the CSP substrate to be mounted with the CSP substrate already splitted into the pellets, a transfer tray mounting region 80 to be mounted with the transfer tray, wherein the individual pellets are housed, and a pickup means 81, which picks up the pellets from the split-finished CSP substrate mounted on the table 75 and houses the pellets in the prescribed position of the tray mounted on the region 80. A pellet cleaning means 1 to clean the individual pellets is provided on a pellet transfer path extending over from the table 75 to the region 80.
申请公布号 JP2001077057(A) 申请公布日期 2001.03.23
申请号 JP19990251635 申请日期 1999.09.06
申请人 DISCO ABRASIVE SYST LTD 发明人 YOSHIMURA EIICHI;TOGASHI KEN;NAMIOKA SHINICHI
分类号 H01L21/304;B28D5/00;H01L21/00;H01L21/301;H01L21/56;(IPC1-7):H01L21/301 主分类号 H01L21/304
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