| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a board for laser cutting, in which wiring can be cut finely with laser along a cut line, and a liquid crystal display unit panel constituted of the board for laser cutting. SOLUTION: A board for laser cutting contains a board, having an inner surface 142a and an outer surface on which a cut line is shown, a wiring 146 of a conducting layer, which is formed along a corresponding cut line of the inner surface which line corresponds to the cut line of the outer surface of the board, and a buffer layer 144 which is interposed between the inner surface of the board and the wiring of the conducting layer along the cut line. In this board, the board and the buffer layer 144 are cut by irraduation of laser beams having different wavelengths, and the buffer layer 144 propagates crckes generated by an adjacent wiring.</p> |
