| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for a microwave semiconductor device, where isolation is improved by suppressing reduction of the cavity resonance frequency. SOLUTION: A metallic ring 2 is formed which is thinner than the outer wall at sides, where leads 4 are attached and thicker than the outer wall at sides where no leads 4 are attached. A side surface of the ring 2 facing the center of a package is attached to the package so as to be flush with the innermost surface 5a of a feed section 5. A cavity, forming a clearance between a radiating plate 1 and the ring 2, is made smaller than when the ring 2 is attached to a substantially central portion on the bottom of the outer wall, whereby the inductance of the cavity can be reduced. Furthermore, the ring 2 is easily machinable, since its opposed sides have the same thickness and its adjacent sides have different thicknesses.
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