| 摘要 |
PROBLEM TO BE SOLVED: To provide a protective member for the wafer up-down device of a plasma processing device, where the protective member is excellent in plasma resistance and can be stably used for many hours. SOLUTION: A protective member is a hollow member to protect a wafer up-down device provided inside a plasma processing device, and the hollow member is integrally formed of carbon material which is 1×10-2Ω.cm or below in volume resistivity and 5 W/m.K or above in thermal conductivity. It is preferable that the protective member is as thick as 3 mm or above, and its peripheral surface is 2.0μm or below in average roughness (Ra).
|
