MOUNTING STRUCTURE OF SEMICONDUCTOR CHIP

摘要

PROBLEM TO BE SOLVED: To provide a mounting structure for mounting and removing a semiconductor chip to a wiring board at a single touch. SOLUTION: A projected part 20 is provided at a connection terminal 12 of a semiconductor chip. An insulating board 32 of a wiring board 5 has a recessed hole 40 for engaging the projected part 20 loosely. The inner circumferential edge of a flat conductive ring 52 at the edge of a conductive circuit 50 formed on a surface of the insulating board 32 is projected into eaves shape at an upper opening edge of the recessed hole 40. A middle part of the projected part 20 of the semiconductor chip is held against the elasticity of the conductive ring 52 and inserted removably into the inside of the conductive ring 52 and fitted. At the same time, the lower part of the projected part 20 is engaged loosely with the hole 40 of the insulating board. In this way, the semiconductor chip 10 can be mounted on the wiring board 30.