| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent the fragment of a substrate from protruding from a carrier or dropping off the carrier onto the base of an etching tank even if the substrate is fractured, by a method wherein a substrate receiving mechanism is arranged under a substrate housing space surrounded with substrate installation side members and connecting side members. SOLUTION: A wet processing carrier 1 is mainly composed of two substrate installing side members 4 which are each provided with grooves 3 where silicon substrates 2 are inserted and installed confronting each other, two connecting side members 5, and a substrate receiving mechanism 6 which is arranged under a substrate housing space surrounded with the substrate installing side members 4 and the connecting side members 5. The substrate receiving mechanism 6 is composed of rods 6a arranged vertical to the silicon substrates 2 and two fixing plates 6b where the tips of the rods 6a are inserted to be fixed and which are provided confronting each other.</p> |
