| 摘要 |
PROBLEM TO BE SOLVED: To allow partial connection of a pattern as well as coping with a complex circuit configuration easier by integrating two circuit boards wherein a conductor pattern with a thorough hole formed in advance is covered with a synthetic resin, with an adhesive in between and the adhesive in the hole, and removing the adhesive in the hole before putting in a conductive material for connection between both patterns. SOLUTION: Conductor patterns 1a and 1b where through hole 3 is formed in advance by press, etc., are embedded in a synthetic resin 2 or covered with it, with the holes 3 of the conductor patterns 1a and 1b of two circuit board plates 20a and 20b which are formed aligned each other. An adhesive 4 is held between the board plates 20a and 20b for pressurizing and heating, and the adhesive 4 is cured to integrate two board plates. The adhesive 4 exposed in the hole 3 of board plate is removed with laser, high-pressure water, or chemicals and a bonding conductor 6 of conductive material is inserted in the holes 3 so that the conductor patterns 1a and 1b of the two board plates are electrically.
|
