发明名称 RELAY MOUNTING METHOD, RELAY UNIT, AND SUB-PLATE USED THEREIN
摘要 PROBLEM TO BE SOLVED: To provide a relay mounting method, a relay unit, and a sub-plate for collectively mounting plural arranged relays on a printed wiring board. SOLUTION: In a sub-plate 15, a plate body 16, four edge parts 17a, 17b perpendicularly protruded from it, two protrusions 18 protruded along the length of an upper surface of the plate body 16, and relay terminal insertion holes 19a, 19b formed at constant interval similarly along the length are integrally cast and molded. A circumference 22 of the relay terminal insertion hole 19a, 19b is formed to be upwardly tapered like a funnel, where tips of relay terminals 3, 4 of a roughly positioned relay 1 are guided to be inserted into the relay terminal insertion holes 19a, 19b. At an upper end part of the edge part 17, an inclination part 21 is formed, a lower end part of the roughly positioned and placed relay 1 is guided to be arranged to a specified position in the plate body 16, so a relay unit 23 is formed. These are then totally mounted on a printed wiring board.
申请公布号 JP2001076602(A) 申请公布日期 2001.03.23
申请号 JP19990254442 申请日期 1999.09.08
申请人 TAKAMISAWA ELECTRIC CO LTD 发明人 WATANABE HAJIME;TAKANO TETSUO;TAKAHATA MASAKI
分类号 H01H45/00;H01H45/04;H01H50/04;H05K1/18;(IPC1-7):H01H45/00 主分类号 H01H45/00
代理机构 代理人
主权项
地址