| 摘要 |
<p>PROBLEM TO BE SOLVED: To make die pads undeformable, even when the die pads receive flow of resin during resin sealing using a comb frame. SOLUTION: A comb frame is fixed using dies 8, so as to clamp at least a part of a die pad from both sides of the die pad (a). Resin 13 is charged to form a pre-molded package 14 (b). Thereafter, a semiconductor element 6 is fixed to one surface of the pad 2, and bonding pads on the element 6 are connected to electrode leads 3 of the package 14 that is molded in advance so as to be exposed, using electrode wires 7 (c). Finally, by cutting from an outer frame 4 of the comb frame 11, and at the same time, by cutting the leads 3 into a prescribed length, a semiconductor device is completed (d).</p> |
