发明名称 ULTRASONIC WAVE EQUIPMENT, FLEXIBLE BOARD USING THE ULTRASONIC WAVE EQUIPMENT AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To form an aperture of satisfactory precision for a resin film on a metal film by using a simple process. SOLUTION: A protrusion 65 is made to abut against a resin film 6 formed on a metal film 1, and ultrasonic vibration is applied, while the resin film 6 is pressed. The resin film 6 is dug, digging is stopped when the tip of the protrusion 65 abuts against the metal film 1, and an aperture part 8 is formed. By arranging the plurality of protrusions 65 at positions corresponding to the positions of the aperture parts 8 to be formed, the plurality of aperture parts 8 are formed simultaneously. Thereby the control of etchant is dispensed with, and precision is high also.
申请公布号 JP2001077504(A) 申请公布日期 2001.03.23
申请号 JP19990246963 申请日期 1999.09.01
申请人 SONY CHEM CORP 发明人 NAKAMURA MASAYUKI;FUKUDA MITSUHIRO;USUI HIROYUKI
分类号 H05K1/02;H05K3/00;(IPC1-7):H05K3/00 主分类号 H05K1/02
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