发明名称 A wafer polishing method
摘要 A method of polishing a wafer comprises a plurality of polishing steps giving a progressively finer polished wafer surface. At least one of these steps comprises a first stage in which the wafer is rotated in a first direction while being polished on a first polishing pad and a second stage in which the wafer is rotated in the opposite direction while being polished on a second polishing pad. The second polishing pad also rotates in the opposite direction to the first polishing pad.
申请公布号 GB2335874(A) 申请公布日期 1999.10.06
申请号 GB19990006866 申请日期 1999.03.24
申请人 * SHIN-ETSU HANDOTAI CO., LTD 发明人 MIKIO * NAKAMURA;TAKAHIRO * KIDA
分类号 B24B1/00;B24B37/04;B24B37/10;H01L21/304;H01L21/306;(IPC1-7):B24B37/04 主分类号 B24B1/00
代理机构 代理人
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