发明名称 |
A wafer polishing method |
摘要 |
A method of polishing a wafer comprises a plurality of polishing steps giving a progressively finer polished wafer surface. At least one of these steps comprises a first stage in which the wafer is rotated in a first direction while being polished on a first polishing pad and a second stage in which the wafer is rotated in the opposite direction while being polished on a second polishing pad. The second polishing pad also rotates in the opposite direction to the first polishing pad. |
申请公布号 |
GB2335874(A) |
申请公布日期 |
1999.10.06 |
申请号 |
GB19990006866 |
申请日期 |
1999.03.24 |
申请人 |
* SHIN-ETSU HANDOTAI CO., LTD |
发明人 |
MIKIO * NAKAMURA;TAKAHIRO * KIDA |
分类号 |
B24B1/00;B24B37/04;B24B37/10;H01L21/304;H01L21/306;(IPC1-7):B24B37/04 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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