| 摘要 |
A plate 7 for holding a wafer W in order to press it against a polishing pad 4 is made of ceramic (e.g. alumina, silicon carbide or silicon nitride), the face of the plate 7 used to hold the wafer W thereon having been polished. Preferably the opposite side of the plate and its peripheral edge have also been polished. When in use, a silicon, quartz or ceramic wafer W may be held on the plate 7 by means of wax 8. Preferably the plate 7 and the wafer W are polished using the same type of polishing pad and slurry. By polishing the plate 7, ceramic dust and any diamonds arising from the grinding wheel used to grind the plate 7 are removed, thereby reducing the amount of damage experienced by the wafer W while being held by the plate 7. |
