发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING DEVICE
摘要 PROBLEM TO BE SOLVED: To effectively remove abrasive scraps in a polishing or cleaning waste liquor and agglomerated particles, to efficiently recover particles, which are used as an abrasive material or a cleaning agent, and to contrive to make it possible to reutilize the particles. SOLUTION: An abrasive waste liquor is concentrated and thereafter, after particles are separated from the concentrated abrasive waste liquor by a liquid cyclone 6, the less than 1-μm particle diameter particles are chiefly removed separately from the separated particles on the specified conditions by a filter 7a and the particle concentration is adjusted at 5 to 30% by a liquid particle concentration adjusting unit 8 to reproduce an abrasive liquid. The reproduced abrasive liquid is recycled in a semiconductor manufacturing device 1 in the state of a stationary flow by a circulating unit 5. In the filter 7a and the unit 5, the abrasive liquid is pushed out on a flow path at a gas pressure of an atmospheric pressure of 2 to 5 using 1 to 10% of water-containing inert gas, such as nitrogen gas, and the stationary flow of the abrasive liquid is formed.
申请公布号 JP2001077066(A) 申请公布日期 2001.03.23
申请号 JP19990252830 申请日期 1999.09.07
申请人 HITACHI LTD 发明人 OTA KATSUHIRO;SAITO AKIO
分类号 B01D36/02;H01L21/304;(IPC1-7):H01L21/304 主分类号 B01D36/02
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