发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To obtain a waveguide structure of low damages and high working accuracy by performing a reactive ion-etching as well as low damage etching for providing a overhung type waveguide. SOLUTION: A etching (RIE method) is performed halfway through a p-type InP ohmic layer 106 and a p-type InGaAsP clad layer 105 to provide a ridge-like waveguide 108. With phosphor based etchant, the p-type InGaAsP clad layer 105 comprising pn joint and a non-doped InGaAs light-absorbing layer 104 are etched sequentially. Since the ridge-like waveguide 108 is formed by RIE method with the configuration, a high-accuracy work is performed. Furthermore, the p-type InGaAs clad layer 105 and the InGaAs light-absorbing layer 104 are etched with a chemical liquid giving very little damage, since no joint is damaged for reduced leakage current.
申请公布号 JP2001077402(A) 申请公布日期 2001.03.23
申请号 JP19990252801 申请日期 1999.09.07
申请人 OKI ELECTRIC IND CO LTD 发明人 SANO YOSHIAKI;KASAGI MASAKATSU;MORI MIKIO;YAMAGISHI NAGAYASU
分类号 H01L21/302;H01L21/306;H01L21/3065;H01L31/10;(IPC1-7):H01L31/10 主分类号 H01L21/302
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