发明名称 ELECTRONIC COMPONENT HOUSING CONTAINER
摘要 PROBLEM TO BE SOLVED: To provide an electronic component housing container where an electronic part is sealed airtight inside the vessel comprising an insulating base body and a lid, causing no deterioration in characteristics, for correct and stable operation of the electronic component over an extended period. SOLUTION: An insulating base body 1 on which an electronic part 3 is mounted, a lid body 2 which is so jointed via a sealing material 8 for enclosing the mounting component, and a wiring conductor layer 5, where being formed from near the mounting part to the outside of joint with the lid body 2 on the surface of the insulating base body 1, an electrode of the electronic component 3 is connected electrically to one end on the mounting side, while an external electric circuit to the other end side, are provided. Here, related to the wiring conductor layer 5, the joint with the lid body 2 is coated with a glass layer 10, while an exposed surface except for the joint is coated with a gold- plated layer 9a. Thus, the electronic component 3 is housed airtight inside a vessel 4, comprising the insulating base body 1 and the lid body 2 via the sealing material 8.
申请公布号 JP2001077223(A) 申请公布日期 2001.03.23
申请号 JP19990252043 申请日期 1999.09.06
申请人 KYOCERA CORP 发明人 SHIBATA TAKASHI
分类号 H01L23/04;H01L23/08;(IPC1-7):H01L23/04 主分类号 H01L23/04
代理机构 代理人
主权项
地址