| 摘要 |
PROBLEM TO BE SOLVED: To obtain an infrared transmission/reception module, having connecting terminals which can be jointed to an external circuit board without hindrance, even if a mask for forming, e.g. an insulating layer is loaded out of place. SOLUTION: The infrared transmission/reception module is constructed, such that a plurality of light-emitting elements and light-receiving elements are mounted on a substrate 2 and are integrated using a resin mold, and can be mounted on an external circuit board B. Connecting terminals 7 are formed on the underside of the substrate 2 for jointing with the board B. Each terminal 7 extends in a substantially rectangular form. |
