| 摘要 |
PROBLEM TO BE SOLVED: To precisely control time until an exposed substrate is heat-treated and to form an uniform line width. SOLUTION: In an interface part 5, a transfer device 110 is arranged so that it faces a second cooling processor group 80 in a processing station 3, a heat processor group 112 where heat treatment devices are arranged in multiple stages is arranged in one side so that the transfer device 110 is interposed therebetween, and peripheral exposure equipment, a buffer cassette and a wafer- holding part 115 are successively arranged in lamination on the other side from the top. A secondary transfer body 116 is arranged between the wafer holding part 115 and an exposure device 4, and a wafer W is carried in/out between an in-stage 401 and an out-stage 402 in the exposure device 4 through the body 116. |
