| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of a crack by installing dielectric layers whose thickness are equal to dielectric layers forming protection armor parts between the dielectric layers forming capacitor main parts and the layers of inner electrodes, dividing the capacitor main parts for respective layers and burning them as a laminated chip element. SOLUTION: The manufacture method of a multilayer ceramic capacitor is to alternately laminate dielectric layers 10 and inner electrodes 11 in prescribed thickness, laminating dielectric layers thicker than the dielectric layers 10 which are alternately laminated with the inner electrodes 11 on an outer most layer as protection armor parts 12 and 13, installing a dielectric layer 14 being a division layer whose thickness is equal to the dielectric layers forming the protection armor parts 12 and 13, laminating capacitor main parts C1 and C2 for respective layers and burning them as a laminated chip element T after pressurizing and press-fixing. Even if the dielectric layers 10 and 12 to 14 are burnt in a neutral or reducing atmosphere whose oxygen partial pressure is low, the occurrence of a structural defect can be prevented even if the thickness of the dielectric layers is thin and the multiple layers are laminated.
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