SOLDERABILITY-TESTING DEVICE AND METHOD

摘要

PROBLEM TO BE SOLVED: To obtain a solderability-testing method and device for improving the accuracy and reliability of test data by reducing influence due to the temperature difference between the temperature of a metal test piece and that of solder paste when testing solderability and the difference between a setting temperature and actually measured temperature of the testing device. SOLUTION: The solderability-testing device for evaluating solderability is provided with a heating member 4 that is capable of controlling temperature being retained with a specific gap to a metal test piece 2, and a means for measuring wetting force while keeping the temperature of the metal test piece 2 at a specific temperature by the heating member 4. Also, the solderability- testing device is provided with a temperature measuring unit with a temperature measuring member 5 for measuring the temperature of solder paste 1 and a temperature display part for displaying temperature being measured by the temperature measuring member 5.