| 摘要 |
<p>The present invention relates to a TO-can type encapsulating element for enclosing, either hermetically or non-hermetically, optical-electrical chips with integrated optical element interfaces, detachable fibres and leadframes. The TO-can/encapsulating element enables the optical fibre ( 9 ) to be readily positioned relative to the chip ( 25 ) with the aid of a fix-able can-flange ( 7 ), and eliminates the risk of crack formation by virtue of the component leads of said TO-can having been provided with and connected to a leadframe ( 6 ).</p> |
