发明名称 COMPONENT ALIGNMENT CASING SYSTEM
摘要 <p>A component alignment casing system (10) for connecting circuits, and a method for making or assembling the component alignment casing system is disclosed. The system has at least one surface mountable component (12) which has a plurality of exposed leads (28), a prepared component (14) which has a plurality of exposed traces (16), an alignment base (18) onto which the prepared component (14) and the surface mountable component (12) are laid, and a compressive cover (20) that attaches to said alignment base (18). The alignment base (18) has a plurality of alignment ribs (22) to isolate and align the exposed traces (16) of the prepared component (14). The prepared component (14) and the at least one surface mountable components (12) are electrically connected and attached together, preferably by soldering. The method includes laying the prepared component (14) on the alignment base (18) and ribs (22), and overlaying the surface mountable component (12), with its exposed leads (28), onto the alignment base (18) and the prepared component (14), and electrically connecting the components together, preferably by soldering, to the alignment base (18). The cover (20) is then snapped on, and supplies compressive force to assure good contact between the leads (28) of the surface mountable component (12) and the traces (16) of the prepared component (14).</p>
申请公布号 WO0120737(A1) 申请公布日期 2001.03.22
申请号 WO2000US03952 申请日期 2000.02.16
申请人 ROBERTS, JONATHAN, F. 发明人 ROBERTS, JONATHAN, F.
分类号 H05K1/18;H05K3/30;H05K3/34;H05K13/04;(IPC1-7):H02G3/02 主分类号 H05K1/18
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