| 摘要 |
PROBLEM TO BE SOLVED: To prevent defects in mechanical and electrical connections between an element and a package container, an electric short circuit, breaking of an electrode pattern on the element surface, etc., by bringing a projection part except a bump electrode on the element-mounting surface or package electrode of the package container into contact with neither the surface of a surface acoustic wave element and an interdigital electrode formed on the surface nor electrodes such as input and output electrode. SOLUTION: A top surface 35 of the surface acoustic wave element 33, where the inter-digital electrode, input and output electrodes, etc., are formed face down, namely, the top surface 35 is arranged facing the element mount surface 43 of a package container 45, and the surface acoustic wave element 33 and package container 45 are connected mechanically and electrically and mounted across the bump electrode 37. Large-size waste pieces of ceramic and metal sticking on the element mount surface 43 are removed, and then the protective part 44 except the bump electrode 37 on the mount surface of the surface acoustic wave element 33 of the package container 45, e.g. projecting foreign matter is much shorter than the bump electrode 37 and will not come into contact with the surface 35.
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