SEMICONDUCTOR WAFER AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To locate a cut-out position even after a wafer has been cut from an ingot and in random order by installing an identification mark containing position information sliced in the ingot on the surface or the rear face of the wafer. SOLUTION: The ingot of a single crystal silicon is sliced, mirror-polishing is finally executed on the ingot and a silicon wafer W for 12 inches is formed. An identification marker MK is foamed near the notch part N of the wafer W. The identification marker MK contains information on a sliced position in the ingot. The position and the size of the identification marker MK are put so that a trouble does not occur in the formation of a semiconductor element as far as possible. The identification marker MK is marked on the surface or the rear face of the wafer W by a laser marker. The cut position can be specified even if it is cut from the ingot and an order comes apart.