Method of manufacture for integrated circuit cards using hot lamination

摘要

The surface film or overlay (8, 9) of the electronic card is pierced with through holes and laminate with the outer layer (4, 7) with pressure being applied to the assembly as it is heat sealed at about 120 deg C. The through holes have a diameter of 0.2 - 1.4 mm, a pitch of 2 - 20 mm and cover 0.1 to 2.5 % of the film surface.