Intermediate coupling structure for mounting semiconductor chip on printed circuit board has conductor paths between contact pads and bonding pads on opposite sides of dielectric body

摘要

The intermediate coupling structure (10) has a dielectic body (12), e.g. of silicon, provided with a contact surface (14) and an opposing bonding surface (16). Peripheral contact pads (18) for the semiconductoir chip (50) provided by the contact surface arecoupled to respective bonding pads (20) spaced over the entire bonding surface, via conductor paths (22) extending through the dielectric body. The bonding pads are mounted on mounting pads (72) provided by the printed circuit board (70).