METHOD FOR TRANSFERRING INTEGRATED CIRCUIT MICROCHIPS AND IMPLEMENTING DEVICE

摘要

The invention concerns a method for turning integrated circuit chips, which consists in arranging a wafer (1) of chips (5) in a given orientation on a first adhesive film (2); optionally separating the individual chips from the assembly and turning around the chips (5) still fixed to the first adhesive onto a second adhesive (6) which, after the first adhesive has been removed, maintains said chips in the desired orientation, said second adhesive having a higher adhesive coefficient than the first adhesive, optionally after the latter has been degraded. The invention is useful for transferring integrated circuit flip-chips into or onto a module of a card body.