发明名称 SUBSTRATE SURFACE PREPARATION
摘要 <p>A metal substrate is prepared for reception of an organic adhesive or coating by subjecting to a high density plasma, most conveniently provided by an RF DC-biassed hollow cathode discharge, to remote at least half the 'normal' oxide layer and also to pit the surface with micropits. The invention finds application in the aricraft industry for pretreating aluminium and titanium components, particularly for the aerospace industry.</p>
申请公布号 WO2001020056(A1) 申请公布日期 2001.03.22
申请号 GB2000003506 申请日期 2000.09.12
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