发明名称 COPPER COATED POLYIMIDE WITH METALLIC PROTECTIVE LAYER
摘要 <p>A component for use in manufacturing printed circuits, comprising: a laminate that in a finished printed circuit constitutes a functional element, the laminate comprised of: a film substrate formed of a first polymeric material; at least one layer of a flash metal applied to a first side of the film substrate, and at least one layer of copper on the at least one layer of a flash metal, the layer of copper having an essentially uncontaminated exposed surface facing away from the at least one layer of flash metal; and a planar layer of metal that constitutes a discardable element, the layer of metal having an essentially uncontaminated surface that is inert to copper, the laminate being attached to the layer of metal at its borders to define a substantially uncontaminated central zone inwardly of the edges of the sheet that is unjoined at the interfaces.</p>
申请公布号 WO2001019602(A1) 申请公布日期 2001.03.22
申请号 US2000021564 申请日期 2000.08.08
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