Chip card manufacture, providing adhesive at, at least one contact surface between functional component and gap, and irradiating adhesive with microwave radiation

摘要

The method includes the steps of manufacturing a chip card body (1) with a gap for accommodating a functional component (3), inserting the functional component in the gap, whereby an adhesive (2) is used at, at least one contact surface between functional component and the gap, and irradiating the adhesive with a microwave radiation (5). The adhesive may be provided or applied at, at least one surface of the functional component or the gap of the chip card body. An Independent claim is provided for a corresponding chip card.