摘要 |
An organometallic bridged polymer for use in preparing a ceramic composite material which comprises an organosilicon polymer moiety comprising a -Si-CH2- bonding unit and a -Si-Si-bonding unit wherein the silicon atom has, bonded thereto as a side chain, a hydrogen atom, a lower alkyl group, an aryl group, a phenyl group or a silyl group, the ratio of the total number of the -Si-CH2- bonding unit and the total number of the -Si-Si-bonding unit ranging from 20:1 to 1:20 and the ratio of the number of silicon and the number of carbon ranging from 2:1 to 1:2, and a moeity wherein at least some of silicon atoms in said organosilicon polymer moiety are bonded with each other through at least one metal (M) selected from among V, Be, Cr, Ga, Ge, Se, Fe, Mo, Dy, Gd, Tb, Nd and Er or the at least one metal and oxygen; wherein the ratio of the total number of the -Si-CH2- bonding unit and the -Si-Si-bonding unit to the total number of the formed -M-Si- bonding and -M-O-Si- bonding ranges from 2:1 to 500:1, and the polymer has a number average molecular weight of 500 to 100,000. The organometallic bridged polymer can be suitably used for producing a ceramic composite material being free of residual carbon which has an adverse effect on the thermal resistance thereof.
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申请人 |
JAPAN SCIENCE AND TECHNOLOGY CORPORATION;UBE INDUSTRIES, LTD.;KOHYAMA, AKIRA;KATOH, YUTAI;YAMAMURA, TAKEMI;SATO, MITSUHIKO;TANAKA, YOSHIZUMI |
发明人 |
KOHYAMA, AKIRA;KATOH, YUTAI;YAMAMURA, TAKEMI;SATO, MITSUHIKO;TANAKA, YOSHIZUMI |