SEMICONDUCTOR DEVICE PACKAGE

摘要

PURPOSE: A package is provided to maintain heat generated from a device under a certain level and to reuse generated electricity by converting heat into electric energy with coating a thermal conduction material on a semiconductor device package. CONSTITUTION: A semiconductor device includes a package for protecting a certain semiconductor device. A thermal conduction material layer is composed of Bi2Te3. A protection layer is composed of a thermoplastic resin on the thermal conduction material layer composed of the Bi2Te3. The thermal conduction material layer is deposited by using the sputtering method under conditions of a temperature of 0-300°C, an electric power of 1-10 kW, and a pressure of 1-30mTorr. A thickness of the protection layer ranges from 1 mm to 2 mm.