| 摘要 |
An exposure system, an exposure device, an application device, a development device, and a method of controlling the wafer treating environment in the exposure system used at a photolithography step in the process of manufacturing a microdevice, a mask, or the like. An application/development device (11) and an exposure device (12) are connected through an interface device (13). This interface device (13) has a blower (52) for exhausting the air in its transfer chamber (53) to under the floor (54) of a clean room (14). The air in a unit chamber (39) of the application/development device (11) and in each of chambers (78 and 65 to 67) in the exposure device (12) is exhausted to under the floor (54) through the transfer chamber (53). As a result, the pressure in the chambers (78 and 65 to 67) of the exposure device (12) is not raised to a level higher than that in the unit chamber (39), and hence various chemicals from the application/development device (11) do not enter the exposure device (12). Therefore, accurate exposure can be realized while avoiding the troublesome pressure adjustments of the devices (11 to 13) and not increasing the size of the devices (11 to 13).
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