| 摘要 |
A multi-layer printed circuit board assembly (300) that incorporates one or more heating elements (310'') as an inner layer of the assembly such that after screen printing solder paste and the placement of components (252'', 254'', 256''), electrical power can be supplied to the heating elements to locally raise the temperature of the printed circuit board assembly to the level required to reflow the solder paste and create the electrical connection between the component leads and the board conductor tracks. Advantageously the invention not only facilitates the process of connecting electronic components to a printed circuit board assembly but also reduces the financial cost of such in comparison to known processes. |
