Manufacturing method for cantilevered structure used for sensor application involves plasma etching of substrate in window region over portion of substrate thickness in front of support or functional layer

摘要

A support layer or functional layer (3-6) is deposited on the side of a substrate (1). A substrate material for a cantilevered structure in a window region (12) is etched in the side opposite to a layer side up to the support layer or functional layer. The plasma etching of the substrate in the window region is performed over a portion of the substrate in front of the support layer or functional layer. An Independent claim is also included for a sensor structure on a semiconductor wafer.