发明名称 |
HIGHLY STABLE PACKAGING SUBSTRATES AND BROMINATED INDANE DERIVATIVES |
摘要 |
<p>A method of producing a highly stable packaging substrate in which are provided a first precursor having a first backbone and a first ethynyl group , and a second precursor having a second backbone and a second ethynyl group. Furthermore provided is a crosslinker having a first and a second reactive group. The first precursor, the second precursor, the crosslinker, and a solvent are applied onto a surface to form an electrically insulating layer. The first ethynyl group is reacted with the first reactive group in a first carbon-carbon bond formation reaction and the second ethynyl group is reacte d with the second reactive group in a second carbon-carbon bond formation reaction to crosslink the first backbone with the second backbone, thereby forming the packaging substrate. The solvent is removed in a further step.</ SDOAB></p> |
申请公布号 |
CA2384962(A1) |
申请公布日期 |
2001.03.22 |
申请号 |
CA20002384962 |
申请日期 |
2000.09.14 |
申请人 |
ALLIEDSIGNAL INC. |
发明人 |
SCHWIND, DAVID;WAGAMAN, MICHAEL W.;MCCARTHY, THOMAS F. |
分类号 |
C08G85/00;C08G61/00;C08G61/02;C08G61/08;H01L23/14;H01L23/29;H05K1/03;(IPC1-7):C08G61/02;H01L23/00 |
主分类号 |
C08G85/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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