A metal substrate is prepared for reception of an organic adhesive or coating by subjecting to a high density plasma, most conveniently provided by an RF DC-biassed hollow cathode discharge, to remote at least half the "normal" oxide layer and also to pit the surface with micropits. The invention finds application in the aricraft industry for pretreating aluminium and titanium components, particularly for the aerospace industry.
申请公布号
WO0120056(A1)
申请公布日期
2001.03.22
申请号
WO2000GB03506
申请日期
2000.09.12
申请人
THE UNIVERSITY OF SHEFFIELD;SHORT, ROBERT, DAVID;GORUPPA, ALEXANDER, ALEXANDROVICH