发明名称 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING THE SAME, MANUFACTURE OF RESIST PATTERN AND PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin composition highly superior in adhesion at overdevelopement, resistance to chemicals, reduction of minimum developing time, adhesiveness, and resolution. SOLUTION: This photosensitive resin composition comprises essentially of (A) a binder polymer having carboxyl groups and styrene or its derivative as a copolymer component, (B) a photopolymerization initiator, and (C) a compound represented by a general formula, in which R1 is an H atom or a 1-3C alkyl; X is an ethyleneoxide group; Y is a propylene oxide, isopropylene oxide, butylene oxide, pentylene oxide, or hexylene oxide group; Z is a 2-16C hydrocarbon group; and each of (n), (m), (p), and (q) is, independently, an integer of 1-14, and the compound comprises in the molecule, a photopolymerizing compound including at least one polymerizable ethylenically unsaturated radical.
申请公布号 JP2000181056(A) 申请公布日期 2000.06.30
申请号 JP19980355960 申请日期 1998.12.15
申请人 HITACHI CHEM CO LTD 发明人 KUSHIDA MASATAKA;KAJIWARA TAKUYA;ICHIKAWA TATSUYA
分类号 H05K3/06;C08F220/34;C08F291/00;C08F299/02;G03F7/004;G03F7/027;G03F7/028;G03F7/033;H05K3/18 主分类号 H05K3/06
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