| 摘要 |
PROBLEM TO BE SOLVED: To obtain a plating layer which prevents the generation of whiskers and is uniform without using Pb by applying Sn plating on the surfaces of conductors made of Cu or Cu alloy and working the plated conductors by rolling or drawing to prescribed shapes, then subjecting the conductors to a specific heat treatment at a specific temperature. SOLUTION: This process for producing parts for wiring consists in laminating the parts for wiring with insulating films subjected to the heat treatment for 0.5 to 3 seconds at 232 to 350 deg.C. The plating of an Sn layer of 0.5 to 10μm in film thickness is applied on the surfaces of the Cu conductors to form the flat square conductors having the sectional sizes of 0.02 to 0.1 mm in thickness and 0.1 to 1 mm in width and thereafter, the conductors are heat treated (preferably for 0.5 to 3 s at 232 to 290 deg.C). Two or more pieces of such flat square conductors are lined up to a plane form and are laminated with insulating films at 0.15 to 1.2 mm pitch between wire, by which a flexible flat cable of the parts for wiring is produced. The purity of the Sn to be plated is specified to >=99.9%.
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