发明名称 FILAMENT BUNDLING GUIDE
摘要 PROBLEM TO BE SOLVED: To provide a filament bundling guide for continuously housing a filament bundle comprising plural filaments in a filament housing container with a good operating efficiency. SOLUTION: This filament bundling guide 4 is used when bundling plural filaments Y spun from a spinneret, forming a filament bundle and taking off the resultant filament bundle into a filament housing container 7. A filament bundling part 8 is opened into a nearly U-shaped form and an angular aperture which is an angle formed by both ends of the filament bundling part 8 forming the shape of U is 30-60 deg. and the radius of an inscribed circle inscribed in straight lines connecting both the ends of the filament bundling part 8 forming the shape of U and the U-shaped part is >=3 mm in the shape of the bottom.
申请公布号 JP2001073223(A) 申请公布日期 2001.03.21
申请号 JP19990247238 申请日期 1999.09.01
申请人 NIPPON ESTER CO LTD 发明人 TANAKA KATSUAKI;YOSHIKAWA TETSUO
分类号 D01D11/04;(IPC1-7):D01D11/04 主分类号 D01D11/04
代理机构 代理人
主权项
地址