| 摘要 |
PROBLEM TO BE SOLVED: To obtain a plating layer of a uniform thickness by uniformly supplying a plating liquid to the treatment surface of a substrate. SOLUTION: This substrate plating device for applying a plating treatment on a wafer W has a holding mechanism 1 which holds the wafer W, an upper cup 10 which covers the wafer W held in the holding mechanism 1 from above, a positive electrode 14 which is disposed in the upper cup 10 and is arranged to face the treatment surface WF of the wafer W above the wafer W held by the holding mechanism 1, a negative electrode 7 which is electrically connected to the wafer W held in the holding mechanism 1, a power source unit 15 which feeds electricity in such a manner that current flows between the positive electrode 14 and the negative electrode 7, plural partition plates 22 which are arranged between the holding mechanism 1 and the positive electrode 14 within the upper cup 10 and have holes 21 allowing the passage of the plating liquid and a treating liquid supply nozzle 25 which supplies the plating liquid between the positive electrode 14 and the partition plates 22.
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