| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition capable of giving a glass epoxy laminated product such as a printed wiring board exhibiting excellent flame-retardancy without containing a halogen and also excellent in heat resistance, moisture resistance, chemical resistance and the like. SOLUTION: The subject halogen-free, flame-retardant epoxy resin composition comprises, as essential ingredients, 10-(2,5-dihydroxyphenyl)-10-hydro-9- oxa-10-phosphaphenanthrene-10-oxide or a derivative thereof (A), at least one polyepoxide compound (B) such as a bisphenol A type epoxy resin or the like, a curing agent (C) for an epoxy resin such as a bisphenol A type novolak resin or the like and an inorganic filler (D) such as aluminum hydroxide or the like.
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