| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor having reduced specific permittivity and coping with a high frequency and excellent in fluidity under circumstances of a steady increase in an operating frequency of a semiconductor element. SOLUTION: The subject epoxy resin composition for sealing a semiconductor comprises, as essential ingredients, components (A) through (D) below, wherein the components (A) and (B) are adjusted so that the total (X+Y) of an epoxy equivalent X of the component (A), that is, an epoxy resin, and a hydroxyl equivalent Y of the component (B), that is, a phenolic resin is at least 350. (A): An epoxy resin. (B): A phenolic resin. (C): A curing accelerator. (D): An inorganic filler.
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