| 发明名称 |
Method and apparatus for partially encapsulating semiconductor chips |
| 摘要 |
<p>A method for partially encapsulating a semiconductor chip (1) mounted on a substrate (2) is disclosed, wherein the substrate (2) is placed on a first mold halve (4) of a mold, a film (7) is placed between the semiconductor chip (1) and a second mold halve (5), the film (7) is pressed against the semiconductor chip (1), and encapsulating material (21) is injected into the mold. <IMAGE></p> |
| 申请公布号 |
EP1085566(A1) |
申请公布日期 |
2001.03.21 |
| 申请号 |
EP19990810829 |
申请日期 |
1999.09.16 |
| 申请人 |
"3P" LICENSING B.V. |
发明人 |
DE KOK, JOHANNES MARINUS MARIA, DR. |
| 分类号 |
H01L21/56;H01L23/31;(IPC1-7):H01L21/56 |
主分类号 |
H01L21/56 |
| 代理机构 |
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| 主权项 |
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| 地址 |
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