| 摘要 |
PROBLEM TO BE SOLVED: To provide non-leaded solder whose melting point, wettability, and mechanical strength are not different from those of the conventional solder. SOLUTION: The non-leaded solder is composed essentially of Sn, and the balance composition includes 0.3 to 1.0 mass % Cu, 0.001 to 0.100 mass % Ga, 0.001 to 0.010 mass % P, 0.01 to 1.00 mass % Ag, and 0.001 to 0.010 mass % Ni.
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