| 发明名称 |
Thermoplastic molding composition |
| 摘要 |
<p>Disclosed are thermoplastic molding compositions comprising a polyester or polyamide, an impact modifier composition comprising a silicone compound, and an epoxy- or orthoester-functionalized compound.</p> |
| 申请公布号 |
EP1085052(A2) |
申请公布日期 |
2001.03.21 |
| 申请号 |
EP20000303340 |
申请日期 |
2000.04.19 |
| 申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
KHOURI, FARID FOUAD;BROWN, STERLING BRUCE;SINGH, NAVJOT |
| 分类号 |
C08K5/5435;C08J5/00;C08K5/54;C08K5/5415;C08K9/06;C08L67/02;C08L77/00;C08L77/02;C08L77/06;C08L83/04;(IPC1-7):C08L67/02 |
主分类号 |
C08K5/5435 |
| 代理机构 |
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代理人 |
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