IMPROVED ACIDIC COPPER ELECTROPLATING SOLUTION

摘要

PROBLEM TO BE SOLVED: To provide an improved acidic copper electroplating bath composition. SOLUTION: This improved bath solution contains a leveling containing an at least one kind of carriers, an organic brightening agent containing a water-soluble mercapto group and an organic compound containing single or multiple charge parts in an acidic bath solution. These electroplating bath compsns. are used for copper plating of the latest interconnect on a semiconductor device.